| 產品/業務 | 三大核心技術 1.雷射微蝕刻 Laser etching ●特點: 雷射綠色生產技術 laser green technology 生產彈性化無光罩 free-mask production 精微製程簡單及高良率 simple micro-machining process with high yield 無熱效應 free-thermal effect ●規格: 蝕刻線寬 etching groove resolution 蝕刻深度控制 etching depth resolution ●應用: 薄膜線路直寫 thin film direct writing 厚膜線路直寫 thick film direct writing 2.雷射微鑽孔 Laser micro drilling ●特點: 可鑽任意形狀微孔 custom micro drilling shape 取代機鑽孔徑限制 overcome traditional driller limited 競爭電漿快速 faster than plasma solution ●規格: 孔徑 drilling holes diameter 深度控制 drilling depth resolution ●應用: TGV/TSV鑽孔 glass/silicon/sapphire drilling 探針卡鑽孔 ceramic vertical drilling 表面微結構 surface micro-structure 3.雷射微切割 Laser micro cutting ●特點: 切割道小 small cutting groove 無碎裂及應力裂紋 free-crack and stress inside 高良率及無耗損 high yield with free routing cost ●規格: 切割溝 cutting grove 深度控制 depth resolution ●應用： Micro-LED cutting Wafer cutting 機能性薄膜切割 functional materials cutting |
